规格参数：
| 技术规格 |
TH-LV-01 |
| 激光器 |
/ |
| 加工速度 |
100-150K/H |
| 运用领域 |
晶圆裂后，散粒外观检测 |
| 上下料方式 |
震荡盘供料、高频吹气下料 |
| 检测速度 |
100-150K/H |
| 相机帧率 |
120fps |
| 误判率 |
≤1% |
| 相机配置 |
上下双CCD |
| θ轴 |
360deg |
| 加工尺寸 |
40-160mil |
| 检测功能 |
1.外圈缺损； |
| 2.晶粒尺寸； |
| 3.亮度差异； |
| 4.切割偏位； |
| 5.玻璃缺陷； |
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